Packaging and production technologies for medical, electronic products (Aufbau- und Verbindungstechnik in medizinischen, elektronischen Produkten) ID: EI71044
| Content | The course will show the participants the industrial technologies for packaging and series production of electronics within medical products. The contents will be presented in a lecture to introduce the students to basics, characteristics as well as standards and applications of the technologies. Examples from industry will illustrate and visualize the contents. In the tutorial the students may elaborate short case studies, profiles or similar according to focus and interest. In detail, the lecture treats packaging and production technologies of electronic devices, methods for manufacturing and production of electronics until production techniques for series production of medical products. As an example, we discuss bonding, chip-on-board, packaging on device level, continuing with SMD assembly, soldering techniques and integration to products by industrial forming technologies.
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| Format | Lecture and exercise |
| Language | German |
| Dozent | Dr.-Ing. Tobias Rauch |
| Credits | 3 ECTS |
| SWS | 2 SWS |
| Semester | WS |
| Time | Thurday 17:00 - 18:30 Uhr Kickoff: 26.10.2023 |
| Place | Place: TranslaTUM, 1st. floor, seminar room 22.1.27 |
| Examination | An oral exam with 30min preparation time on an individual problem the students demonstrate the achievement of learning results by a 10min presentation and by answering questions about the content of the lecture: characteristics and requirements of the specific packaging and production technologies and their application in industrial production. 50% Grade of presentation / 50% Grade of interview |