Applications of graphenic carbon materials
Sputtered Graphenic Carbon: IEDM 2018
Graphenic Carbon-Silicon Schottky Diodes: IEDM 2016
UPDATE: It seems that Intel's and Micron's 3D XPoint memory is using carbon interconnect material as its
OTS and PCM contacts. The TEM-images indicate a low density (~2 g/cm3) interconnect material like carbon.
https://ieeexplore.ieee.org/abstract/document/8353635/ and https://ieeexplore.ieee.org/document/8739746
and https://link.springer.com/article/10.1007/s10854-019-02373-y
High performance x-ray windows
Ultrastrong membranes for x-ray windows
Ultimate tensile strength of graphenic carbon is increased to ~7 GPa
The carbon-nanotube computer has arrived - article published in Nature
The most complex electronic device yet built from carbon nanotubes has been demonstrated. The system is a functional universal computer, and represents a significant advance in the field of emerging electronic materials. Read more here.
Carbon nanotubes finally deliver - article published in Nature
A carbon-nanotube transistor has been made that performs better than the best conventional silicon analogues. The result propels these devices to the forefront of future microchip technologies. Read more here.
CMOS without dopants: Reconfigurable Silicon Nanowire Transistors
ITRS2.0 working group on ERD (emerging research devices) ITRS_2015_Beyond_CMOS_ERD_Report
coming soon
New memory technologies (ReRAM)
carbon-based resistive memory
recently IBM jumped on the this topic and
made an illustrative video
related patents:
March 8, 2007 Carbon memory US7728405B2
October 27, 2006 Carbon filament memory and fabrication method US7894253B2
Carbon-based interconnect technology
coming soon
Nanosytems
coming soon