The two papers on horizontal carbon nanotube bundle interconnects have just been published in one issue of the IEEE Transactions on Electron Devices.
Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications – Part I: Process Development
Hong Li, Wei Liu, Alan M. Cassell, Franz Kreupl and Kaustav Banerjee
IEEE Transactions on Electron Devices, Vol. 60, No. 9, pp. 2862-2869, 2013.
http://dx.doi.org/10.1109/TED.2013.2275259
Low-Resistivity Long-Length Horizontal Carbon Nanotube Bundles for Interconnect Applications – Part II: Characterization
Hong Li, Wei Liu, Alan M. Cassell, Franz Kreupl and Kaustav Banerjee
IEEE Transactions on Electron Devices, Vol. 60, No. 9, pp. 2870-2876, 2013
http://dx.doi.org/10.1109/TED.2013.2275258
The work is based on collaboration with Prof. Banerjee's group at University of California, Santa Barbara and with Alan Cassell from NASA Ames Research Center in Mountain View.