Hsinchu and Tainan, March, 2013
On March 5 and 6, Prof. Kreupl will speak at the Symposium on Emerging Logic Technologies and Advanced Memory Technologies in the Ambassador Hotel Hsinchu. On March 7, he will speak at the Symposium on Emerging Logic Technologies in Tainan Science Park.
The modern MOSFET era has seen numerous changes in transistor materials and fabrication, a trend that is expected to accelerate from the 20nm node onward. 3D represents a host of new challenges, however, not the least of which is the increase in number of process steps involved. Others involve advanced patterning, atomic-precision etch, interface engineering, and conformal doping of 3D surfaces.
Distinguished guest speakers from IBM, SK hynix, Technische Universität München, and Toshiba will address these challenges and emerging solutions.
Prof. Kreupl will talk about "Material and Design Aspects of ReRAM Technology" and "New Materials at Horizon for Advanced Logic Technology in Mobile Era".