Xu, Pengcheng
Dr. Pengcheng Xu
Technical University of Munich
Chair of Circuit Design (Prof. Brederlow)
- Phone: +49 89 289 22908
- Office hours: nach Vereinbarung
- Room: 0108.01.818
- E-mail: pengcheng.xu@tum.de
Curriculum Vitae
I am a research associate with the Chair of Circuit Design at the Technical University of Munich.
I received my B.Sc. in Physics from Shanghai Normal University, Shanghai, China, in 2013. I then studied Integrated Circuit Engineering at Tongji University, Shanghai, China, and obtained my M.Sc. degree in 2016. In 2015, I was an exchange student at Friedrich-Alexander University Erlangen-Nuremberg, Germany. I completed my Ph.D. in Electrical Engineering at the Université catholique de Louvain, Louvain-la-Neuve, Belgium, in 2021.
My research focuses on the design of analog and mixed-signal integrated circuits. In 2016, I worked as an Analog IC Engineer at Huawei. From 2017 to 2020, I was a Research Assistant in Electrical Engineering at the Université catholique de Louvain. From 2020 to 2023, I worked as a Research Associate in the Circuits and Systems Department at Fraunhofer EMFT in Munich, Germany. Since 2023, I have been with the Technical University of Munich.
I am the author and co-author of numerous scientific publications in leading journals and international conferences, including the IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), the IEEE International Solid-State Circuits Conference (ISSCC), the European Solid-State Circuits Conference (ESSCIRC), the Asian Solid-State Circuits Conference (ASSCC), and the IEEE International Symposium on Circuits and Systems (ISCAS). In addition, I am the inventor of a filed European and U.S. patent in the area of RF energy harvesting.
I am a member of IEEE and served as Chair of IEEE Young Professionals Germany from 2023 to 2024. I also serve as a reviewer for various international journals and conferences, including IEEE JSSC, IEEE TCAS-I/II, IEEE Wireless Communications Letters, IEEE Transactions on Power Electronics, IEEE Access, and the IEEE ICECS Conference. From 2022 to 2024, I was also a member of the Technical Program Committee (TPC) of the IEEE Design Automation Conference (DAC).
I have received several awards in recognition of my academic and scientific achievements, including the Shanghai Outstanding Graduate Award in 2013 and 2016, the Meritorious Winner Award in the Mathematical Contest in Modeling (MCM) in 2013, the Chinese Government Award for Outstanding Self-Financed Students Abroad in 2020, and the Chinese National Scholarship in 2012, 2014, and 2015.
Research
My research focuses on analog and mixed-signal integrated circuit design. In terms of applications, I have research experience in power management, energy harvesting, and neuromorphic accelerator design.
Feel free to contact me if you are interested in pursuing a Master’s or Bachelor’s thesis in one of these areas.
2025
C. Riehm, T. Chlan, V. Verma, P. Xu, R. Brederlow. "Including Package-Induced Mechanical Stress in Bandgap Reference Circuit Design." IEEE European Solid-State Electronics Research Conference (ESSERC), 2025
2024
J. Weber, L. Zhang, P. Xu, D. Borggreve, F. Vanselow, E. Hennig. “An Enhanced ACBC Three-Stage Amplifier Using Complementary Indirect Miller Compensation.” IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2023
2023
L. Zhang, P. Xu, D. Borggreve, F. Vanselow, R. Brederlow. " A FeFET In-Memory-Computing Core with Offset Cancellation for Mitigating Computational Errors." IEEE European Conference on Solid-State Circuits (ESSCIRC), 2023.
M. Gonzalez, P. Xu, R. Dekimpe, M. Schramme, I. Stupia, D. Bol. " Limits of 2.45-GHz Wireless Power Transfer for Battery-less Sensors – A SWIPT Room Occupancy Tracking Use Case." IEEE Internet of Things Journal, 2023.
2022
P. Xu, L. Zhang, F. Pscheidl, D. Borggreve, F. Vanselow, R. Brederlow. "A Dynamic Charge-Transfer-Based Crossbar with Low Sensitivity to Parasitic Wire-Resistance." IEEE International Symposium on Circuits and Systems (ISCAS), 2022.
P. Xu, D. Flandre, D. Bol. "Analysis and Design of RF Energy-Harvesting Systems with Impedance-Aware Rectifier Sizing." IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), 2022.
2021
P. Xu, D. Flandre, D. Bol. "A Self-Gating RF Energy Harvester for Wireless Power Transfer with High-PAPR Incident Waveform." Journal of Solid-State Circuits (JSSC), 2021.
D. Bol, M. Schramme, L. Moreau, P. Xu, R. Dekimpe, R. Saeidi, T. Haine, C. Frenkel, D. Flandre. " SleepRunner: A 28-nm FDSOI ULP Cortex-M0 MCU With ULL SRAM and UFBR PVT Compensation for 2.6–3.6-μW/DMIPS 40–80-MHz Active Mode and 131-nW/kB Fully Retentive Deep-Sleep Mode " Journal of Solid-State Circuits (JSSC), 2021.
2020
P. Xu, D. Flandre, D. Bol. "Energy Harvesting System." European Patent, May 31, 2020.
2019
P. Xu, D. Flandre, D. Bol. " Analysis, Modeling and Design of a 2.45-GHz RF Energy Harvester for SWIPT IoT smart sensors." Journal of Solid-State Circuits (JSSC), 2019.
D. Bol, M. Schramme, L. Moreau, T. Haine, P. Xu, C. Frenkel, R. Dekimpe, F. Stas, D. Flandre. "A 40-to-80MHz Sub-4μW/MHz ULV Cortex-M0 MCU SoC in 28nm FDSOI With Dual-Loop Adaptive Back-Bias Generator for 20μs Wake-Up from Deep Fully Retentive Sleep Mode." IEEE International Solid-State Circuits Conference (ISSCC), 2019.
R. Dekimpe, P. Xu, M. Schramme, P. Gérard, D. Flandre, D. Bol. "A battery-less BLE smart sensor for room occupancy tracking supplied by 2.45-GHz wireless power transfer." Journal of Integration VLSI, 2019.
2018
P. Xu, D. Flandre, D. Bol. " Design of a 2.45-GHz RF Energy Harvester for SWIPT IoT smart sensors." IEEE Asian Solid-State Circuits Conference (ASSCC), 2018.
R. Dekimpe, P. Xu, M. Schramme, D. Flandre, D. Bol. "A Battery-Less BLE IoT Motion Detector Supplied by 2.45-GHz Wireless Power Transfer." IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2018.
2017
P. Xu, C. Gimeno, D. Bol. "Optimizing TSPC frequency dividers for always-on low-frequency applications in 28nm FDSOI CMOS." IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017.