Lectures by guest scientists and experts

Integration technologies for sensors and IC on flexible film substrates

Landesberger Christof Tuesday 15.11.22 at 17:00

Technologies for assembly and interconnection of bare IC on flexible film substrates will be explained. Results from former research work at Fraunhofer EMFT on the mechanical stability of ultra-thin silicon chips (down to 12 µm thickness) on polyimide film substrates will be shown. Some application examples for thin and flexible electronics are presented as well.

 

 

Precision measurements in new generation of high power energy conversion systems

Misha Ivanov Tuesday 31.1.23 at 17:00

Energy revolution is on-going in our society and we increasingly use high voltage and high power converter systems in many areas of our lives.  The renewable energy generators, electrical vehicles and their chargers, motor drives and similar devices routinely handle voltages between 800V and 2000 and currents up to 1000A.  To ensure this equipment’s high efficiency and safety, the voltages and currents must be very accurately measured for many purposes: to control the switching of power SiC, GaN or IGBT transistors, to precisely measure the amount of charge in the battery or for billing, and to detect slightest defects in insulation that may endanger the user.   We will discuss the precision sensors, amplifiers and ADCs that are needed to measure the needed high currents and high voltages accurately and without losses.

 

DC/DC Converter

Puneet Sareen Tuesday 14.2.23 at 17:00

 

 

 

 

Analog front end interfaces for MEMS sensors

Francesco Diazzi Tuesday 14.03.23 at 17:00

 

 

 

 

Modelling and design of Interface circuit for hybrid energy harvesters

Ankesh Jain - Tuesday 7.6.22 at 17:00

This work presents the system level modelling of a hybrid energy harvesting device incorporating piezoelectric and electromagnetic transducers in order to optimize its output performance. The designed circuits are simulated for CMOS 180 nm process and the peak improvement obtained using the proposed technique is more than 1.3 times of the combined power when harvested individually.

 

CMOS Integrated Sensors and Sensor-Interfaces

Matthias Völker - Tuesday 21.06.22 at 17:00

Introduction into the work of the department for integrated sensor systems at the Fraunhofer IIS, Erlangen. Covering the range from CMOS integrated sensor elements over sensor interface circuits and important building blocks towards whole sensor systems on a chip.

 

Innovation in the field of ESD and its importance for integrated circuits

Harald Gossner - Tuesday 5.7.22 at 17:00

ESD is becoming more and more important as process nodes become smaller and smaller. In this lecture, new developments and their significance will be presented.

 

 

Design of High speed CTDSM

Ankesh Jain - Tuesday 19.7.22 at 17:00

Continuous-time Delta Sigma Modulators based on 1-bit quantizers with FIR feedback combine the advantages of single-bit and multibit operation. We propose the use of a duobinary test interface to extend the frequency range over which reliable laboratory measurements become possible. We show that using such an interface effectively randomizes the modulator output data and  reduces high frequency content, thereby reducing the bandwidth demands made on the test equipment. It also reduces degradation of the modulator performance caused by package feed-through effects.  Experimental results from a test chip in 90nm CMOS show that the proposed interface extends the upper sampling frequency limit of an existing  single-bit CTDSM from 3.6 GHz to 4.4 GHz.

 

Characterization of High speed CTDSM

Ankesh Jain - Weddnesday 27.7.22 at 17:00

Continuous-time Delta Sigma Modulators based on 1-bit quantizers with FIR feedback combine the advantages of single-bit and multibit operation. We propose the use of a duobinary test interface to extend the frequency range over which reliable laboratory measurements become possible. We show that using such an interface effectively randomizes the modulator output data and  reduces high frequency content, thereby reducing the bandwidth demands made on the test equipment. It also reduces degradation of the modulator performance caused by package feed-through effects.  Experimental results from a test chip in 90nm CMOS show that the proposed interface extends the upper sampling frequency limit of an existing  single-bit CTDSM from 3.6 GHz to 4.4 GHz.