Molnar, Szabolcs

Picture of Szabolcs Molnar

Szabolcs Molnar

Technical University of Munich

Chair of Circuit Design (Prof. Brederlow)

Supports employees as IT system administrator in all IT matters and provides HW infrasruvcurre for the chair.

He also supports the staff in electrical enineering in the area of measurement laboratory at the chair.


Working Experience

2015 – 2020 Re-electronik

4 years of experience as a production worker
8 month group leader and  deputy production manager                  

  • Release and quality inspection of the assemblies
  • Assembly and electronic functional testing of products
  • SMT (0402), THT soldering with iron solder and hot air according to IPC-A- 610D standards
  • Quality assurance
  • AOI (AOI PILOT CAD)programming and operation
  • Visual inspection of the assemblies, also under microscope

2010 – 2014 Microsoft Mobile Devices - Nokia Komárom

Experience as a technician. Repair Center deputy shift group leader

Analysis and troubleshooting: application of analytical methods in the repair of cell phones and test devices, such as measurements of audio, high-frequency and digital signals, furthermore visual troubleshooting by means of microscopes

Electrotechnical knowledge: High frequency communication (GSM, WCDMA, FM), digital technology and control based on PWM.

2009-2010 Foxconn (Product Technician)

Professional Training

Final year 2005: IT Engeneer assistant

Bottyán János technical School: Education organized by Neumann János Faculty of Informatics, Budapest