Bavarian Chip Design Center (BCDC)
The Bavarian Chip Design Center (BCDC) is a joint project between three Fraunhofer Institutes (AISEC, EMFT, and IIS) and five universities and colleges (FAU, HM, OTH, THN, and TUM), funded by the Bavarian Ministry of Economic Affairs, Regional Development and Energy. It aims to reduce the dependence on foreign semiconductor companies by supporting local chip design, production, and talent recruitment.
At TUM several chairs (AI-Pro, CAPS, EDA, LIS, LSE, MNT, MSA, and SEC) collaborate on the design of a RISC-V-based chiplet based demonstrator for high-performance computing.
The chair of Micro and Nanosystems Technology (MNT) designs the interposer for the high-speed interconnect between the chiplets, as well as the printed circuit board (PCB) needed for testing the system. Additionally, there is the goal to develop an RF-chiplet for wireless high data rate communication between chiplets or systems. As a reference for the wireless interface the new IEEE 802.15.3d standard of sub-THz 6G communication is chosen to allow for interoperability with other supporting devices.
