Lymperis Perakis published his master thesis as a paper:
We report findings from a comparative evaluation of several recent object detection models applied to a domain-specific use case in technical document analysis and graphics recognition. More specifically, we apply models from the EfficientDet and YOLO model families to detect and classify figures in electronics datasheets according to a custom classification scheme. We identify YOLOv7-D6 as the most accurate model in our study and show that it can successfully solve this task. We highlight an iterative approach to figure annotation in document page images for creating a comprehensive and balanced custom dataset for our use case. In our experiments, the object detection models show impressive performance levels on par with state-of-the-art results from the literature and related studies.
the paper can be accessed here: https://dl.gi.de/items/7b242ead-e083-4867-b8a4-1600662f628d
Congrats to Lymperis Perakis and the whole team!
Today Vadim Vendt successfully defended his dissertation "Design and Technology of Discrete
Silicon-based Vertical SCR Devices for System-Level ESD Protection".
Congratulations Dr. Vendt!
Congratulations to Dr. Max Stelzer! The award ceremony for Max starts at 1:33:56 h here in the video https://www.ei.tum.de/tdf/
Max Stelzer's thesis is here: https://mediatum.ub.tum.de/doc/1547672/1547672.pdf
Yesterday,
Muhammad Mudussir Ayub successfully defended his dissertation "Pre-Silicon Power and Performance Estimation
and Optimization for System Scenarios of Mobile Communication Platforms".
Congratulations Dr. Ayub!
Thanks to KETEK GmbH, our SEM is now equipped with an EDX detector with low-energy graphenic carbon window. Together with Ketek, our group (Sebastian Hübner) has developed those x-ray windows , which are now in production. Shown in the picture is a spectrum with raw counts of a PTFE sample (taken by Maximilian Küffner) More details can be found here: https://lnkd.in/dNnaayTb
and https://lnkd.in/d6Vpv2m
RIKEN performed first tests:
First test of graphenic carbon vacuum windows with heavy ions within the context of hadron beams.
https://www.nishina.riken.jp/researcher/APR/APR053/pdf/134.pdf
We developed these windows together with KETEK a while ago:
https://www.researchgate.net/publication/273471966_High_Performance_X-Ray_Transmission_Windows_Based_on_Graphenic_Carbon
The activities are part of the EU-project I.FAST:
Today, Max Stelzer successfully defended his dissertation "Highly Reliable Graphenic Carbon-Silicon Contacts" with "summa cum laude". Congratulations Dr. Stelzer!
His PhD thesis can be accessed here: https://mediatum.ub.tum.de/603842?query=Kreupl&show_id=1547672&srcnodeid=603842 https://mediatum.ub.tum.de/doc/1547672/1547672.pdf
Markus Hefele successfully defended his dissertation "Highly Integrated Multichannel CMOS Sensor Systems for Micro-Physiological High-Content Screening Applications". Congratulations Dr. Hefele! He did this work in cooperation with Texas Instruments and Steinbeis-Transferzentrum Medizinische Elektronik und Lab on Chip-Systeme.
Maximilian Küffner joined our group in today. He will work towards his PhD thesis. We wish him a fruitful and successful time here !
Lena Zeitlhöfler published a new paper:
ESD events on semiconductor devices in the pico-or nanosecond range cause local potential differences and are often responsible for severe damages of an IC. The presented simulation approach focuses on the simulation of the transient and local potential distribution on the chip during a discharge on wafer-level. In the approach, the total charge is distributed either via the top metal layer and also via the underlying substrate layer dependent on the IC design. The approach consists of a network-based simulation with uniform cells of lumped elements, which values are determined based on measurement data.
the paper can be accessed here: https://ieeexplore.ieee.org/abstract/document/9245864
Every day they helped to transport tons of pallets with protective material and disinfectants. In 99 logistics bases operated nationwide, THW stores protective materials and disinfectants temporarily and assembles them for further transport to the recipients. In addition, a central coordination body of THW ensures the distribution of protective equipment to federal authorities.
Regardless of its functionality, there is no IC-compatible process to pattern platinum. This can be attributed to the inertness of the noble metal. Pt survives extreme conditions, and is used in electrochemical, temperature, and gas sensors. In this paper, we introduce a process enabling Pt structures of 1 μm thickness and submicron feature size on 200mm wafers. It is the industry's first with focus on high process control while eliminating contamination issues. This is achieved by locally alloying the Pt with a sacrificial Al layer. The so-formed PtAl 2 is then removed by a selective wet-etch, which leaves a uniform Pt structure. The process is VLSI compatible, and can be adapted to any semiconductor fab to have a platinum processing capability. Pt as a third metal besides Al and Cu is a significant enabler for IC sensor technology.
https://ieeexplore.ieee.org/document/9117886
Authors: Umidjon Nurmetov, Tobias Fritz, Ernst Müllner, Christopher M. Dougherty, Michael Szelong,Franz Kreupl, and Ralf Brederlow
U Using an unmodified 130-nm CMOS process,we present the design of an integrated 2-D CMOS stress sensorand trim methodology resulting in 11-bit resolution and 66-dBdynamic range. The n-well-only primary sensing elements andp-type auxiliary elements allow post-calibrated measurement ofboth stress magnitude and angle over the commercial tempera-ture range from 5◦Cto90◦C. The implementation is robust toprocess variation, requires 357μW when active, and is optimizedfor duty cycling to reduce system energy consumption.
Markus Hefele et al. new paper "Integrated multipurpose analog front-end for electrochemical ISFET sensors" is published:
Ion-Sensitive-Field-Effect-Transistors (ISFETs) are an alternative to the common glass electrode for pH sensing. They promise higher integration, easier manufacturing and are interesting for biological, medical and environmental applications. However, they require a different and slightly more complex readout circuit. We propose a new circuit based on a standard mixed-signal-processor with minimal required external components. The operating point of the ISFET is set with a servo loop in software using only the integrated DACs and opamps and an external resistor. With the internal ADC, feedback is provided for the software loop and the result is read. We compare this method with a fully analog ISFET readout circuit and show their equivalence. The new circuit provides some additional features, such as run time configurable operating point and channel type settings. The integrated MCU can also perform calibration and sensor diagnosis functionality and eases the integration in other systems and parallel operation of many units with its digital interfaces.
Have a look here:https://ieeexplore.ieee.org/abstract/document/8961291
for his paper "A CMOS Temperature Stabilized 2-Dimensional Mechanical Stress Sensor with 11-bit Resolution"
https://ieeexplore.ieee.org/abstract/document/8778132
Award ceremony will be held during the 2020 VLSI Symposia, in Honolulu, Hawaii.
<2020 Symposia on VLSI Technology and Circuits>
- Date: June 14-19, 2020
- Venue: Hilton Hawaiian Village, Honolulu
https://vlsisymposium.org/